The Hamburg-based K.D. Feddersen Ueberseegesellschaft mbH a member of the international Feddersen Group, and the Belgian Futerro S.A. have concluded a distribution agreement for the sale of Polylactide (PLA).
New additions to the OQ Luban polypropylene impact copolymer (ICP) portfolio as well as a new LLDPE Rotomoulding offering OQ Luban LL8446.21 will be launched to customers by the end of 2023.
Rotovia, as one of the main sponsors, plans to contribute to the success of the event and, through collaboration with other industry leaders, address the current challenges facing the plastics industry.
Collectives, broad representation of foreign exhibitors and buyers, focus on networking
2022 balance beyond all expectation for Italian manufacturers of plastics and rubber processing systems
Leaping towards high-quality development of plastics & rubber industries with technological innovations
Asiamold – Guangzhou International Mould & Die Exhibition will open from 1 – 3 March 2023 at the China Import and Export Fair Complex in Guangzhou. The fair will once again present fairgoers with advanced mould-making technologies, from leading domestic and international brands.
Plast Eurasia İstanbul Fair continues to grow in 2022 as it brought together the entire stakeholders of the sector in 2021 and offered a unique experience for the exhibitors and visitors, and became a gigantic trading platform by gathering 60.742 professional visitors from 138 countries and 852 leading companies from 39 countries…
Almost 400 Italian companies in the plastics and rubber sector registered for the upcoming edition of K, taking place in Düsseldorf on 19-26 October 2022.
Interplas, the UK's leading plastics industry event that showcases manufacturing processes, technologies and services essential to the plastics sector returns to the NEC, Birmingham 28-30 September 2021 after a COVID-19 postponement for 2020.
Dr BOY insert moulding machines with vertically arranged clamping units offer many advantages for an automation of the production process. In particular, the easy and space-saving integration of peripheral equipment and the possibility for rapid changeover are decisive factors.
