The fully recyclable packaging concept by Südpack will be on display on the rotary form, fill and seal machine FME 50 in hall 8.1 at stand B-049 of SN German Pouch-Pack Technology.
During its appearance at JEC World 2022 in Paris, Lanxess will be primarily focusing on the megatrends of electromobility and sustainability.
From 27 to 29 September 2022, the packaging industry will once again gather for three days to share information and knowledge with their customers and business partners, find out about the latest trends and innovations, and be inspired by interesting speakers and topics.
Wittmann Battenfeld with sustainable high-tech products at the Plastpol
JEC World is pleased to announce the dates of the show in 2023 and 2024, taking place in Paris Nord Villepinte.
Resealable flow packs have been a preferred packaging concept for sliced meat, sausage and cheese products for many years.
Preparations are in full swing for Fachpack, to be held in Nuremberg from 27 to 29 September 2022. With its new key theme this year, “Transition in Packaging”, the trade fair is focusing on the upheavals in the packaging industry.
Two completely different types of injection moulding machines will be presented by BOY at the Plastpol plastics trade fair (24 - 27 May) in Kielce / Poland.
JEC World 2022 from 3 to 5 May in Paris, France, showcases the entire value chain of the composites industry. One important step in this chain is the shaping of thermoplastic fibre-composite preforms.
Moretto awaits you at: FIP, Lyon, Stand J11 / K12 Interplast, Joinville, Stand 564 International Industry Fair, Celje, Stand 01 - Hall K Plastec West, Anaheim, Stand 3955
The exhibits that Arburg has prepared for Plastpol 2022 in Kielce, Hall E, Stand E-30, from 24 to 27 May, cover the entire spectrum of modern injection moulding production.
Arburg will be demonstrating its expertise in circular economy and resource conservation with a turnkey system producing cups from bio-based polypropylene (PP) with a lasered R-Cycle code for single-sort recycling.
