Future of the North American Packaging Market
Smithers Pira examines the key areas of growth and the main challenges to the North American Packaging Market in the next four years.
Packagings
News Plastech
New concept for food fackaging from LyondellBasell
New addition to Toppyl family of polyolefin resins provides a new level of convenience and ease of use, without sacrificing protection.
Consumer trends shaking up the packaging industry
The latest Smithers Pira report contains an overview of the most important trends in the packaging industry.
Thinking thin: it pays to consult a specialist
El-Exis machines from Sumitomo (SHI) Demag have become the equipment of choice for many thin wall moulding specialists.
Derprosa will exhibit at the LuxePack Monaco fair
In Monaco Derprosa will display the latest products from its Elegance range and its films with metallised finishes.
More on M&A, packaging printing and communicating with the customer
At the Pira Packaging Summit delegates will hear from representatives across the packaging supply chain and hear perspectives on all that is currently developing in and around packaging today.
Programme for the Pira Packaging Summit 2013 announced
The programme for the Pira Packaging Summit 2013 features a high-profile line-up of speakers from across the packaging industry.
Plastics and packaging market grows in West Africa
Imports of plastics, printing and packaging machinery see double-digit growth in West Africa.
Lanxess at drinktec 2013
Lanxess will present its Velcorin technology for cold sterilization and the new Velcorin DT Touch dosing technology for the beverage industry.
Carton board as the base for transport packaging
Finnish Eltete Group manufactures the pallets and transport boxes based on paper board.
Particle foams for packaging industry
At FachPack 2013 BASF will present range of particle foams enhancing safety of packaging.
The "Maison Surlyn" unveils its new collection
DuPont Surlyn is used for a new decoration technology developed by DuPont and Oriol & Fontanel.
