Arburg at Chinaplas 2018: "Wir sind da."
Industry trendsetter: Innovative technologies for Industry 4.0, injection moulding and additive manufacturing
Fairs
News Plastech
China PEC’2018 - Professional and Representative Plastics Exhibition
The 18th China Plastics Exhibition &Conference (China PEC’2018)
ENGEL at the Plastics & Rubber Vietnam 2018
At Plastics & Rubber Vietnam, which takes place from March 20th to 22nd, 2018 in Ho Chi Minh City, ENGEL will manufacture food containers to demonstrate how these demands can be met in practical situations.
Upcycling in the production of food
Sustainability and environmental management play an important role in the food industry. Nevertheless, regardless of how efficiently the machines work and how resource-friendly they produce, at the end of the day the manufacturers are still faced with the question: What to do with the waste materials that are left over? Anuga FoodTec from 20 to 23 March in Cologne holds answers in store for the visitors.
Kick-off for K 2019
Registration documents now available
CHINAPLAS 2018 to launch Young Tech Hall
To facilitate visitors’ need of sourcing new CHINAPLAS suppliers, a “Young Tech Hall” will be newly introduced at CHINAPLAS 2018. This is a comprehensive exhibition hall, which will gather together new exhibitors from diverse fields.
Arburg at the Pharmapack Europe 2018: First-hand expertise
On 7 and 8 February 2018, Arburg will be represented at the Pharmapack Europe 2018 in Paris. Here, the experts will provide information on the extensive range of machines and solutions for plastic part production in the medical technology, clean room and packaging sectors.
Prestigious address of the plastics industry professionals: Plast Eurasia Fair
27th International İstanbul Plastics Industry Fair was organized on 6 - 9 December, 2017 at Tüyap Fair Convention and Congress Center, İstanbul.
Strong interest in the Freeformer and functional parts from Arburg
More than 21,000 trade visitors flocked to the formnext 2017 in Frankfurt, almost half of them from abroad. For Arburg, which has been an exhibitor from the very outset, the fair was a great success.
High-performance for the packaging industry
At the Interplastica 2018, to be held in Moscow, ARBURG will present a high-speed thin-wall application for the packaging industry
Labelexpo Asia 2017 focuses on digital and smart technologies
Labelexpo Asia 2017 will present the Digital Trail and Smart Zone features for the first time. Taking place in Halls E1 and E2 of the Shanghai New International Expo Centre (SNIEC) from 5 - 8 December, they will highlight the latest advances in these technologies and their respective applications for label and package printing.
Innovation is Key to the Future
China is rapidly becoming a preeminent new market in the world. With over RMB 1.5 trillion spent in R&D in 2016, a 10.6% annual increase, and of which 77.5% was contributed by businesses, the overall productivity and comprehensive national power of China is strategically being boosted, enhancing the country's influence in technology innovations.
