
Wittmann Battenfeld with full Power at the Plast in Milan
From May 29 to June 1, Wittmann Battenfeld will present to interested trade visitors latest injection molding technology as well as automation and peripherals at the Plast in Milan.
From May 29 to June 1, Wittmann Battenfeld will present to interested trade visitors latest injection molding technology as well as automation and peripherals at the Plast in Milan.
At the Plastpol 2018, from 22 to 25 May, the Wittmann Group will present with its subsidiary Wittmann Battenfeld Polska ultra-modern injection molding technology, automation and peripherals.
ENGEL is set to welcome visitors to the smart factory at Elmia Polymer 2018, Scandinavia’s biggest trade fair for plastics and rubber processing, which takes place from May 15th to 18th in Jönköping, Sweden.
At the Chinaplas 2018, Wintec - member of the Engel group of companies - will demonstrate with two machine exhibits how high quality can be combined with cost effectiveness and energy efficiency for the most varied requirements of standard applications.
From April 24 to 27, WITTMANN BATTENFELD will present latest injection molding technology for the plastics industry to trade visitors at the Chinaplas in Shanghai, the largest plastics fair in Asia.
With WITTMANN 4.0, the WITTMANN Group is presenting the only solution in the injection molding industry so far, which fulfills all requirements in terms of complete data acquisition and offers maximum flexibility for the combination of several production cells as well.
Gebo Cermex, part of the Sidel Group and world leader in packaging line engineering and material handling solutions, has recently signed a supply agreement with KUKA AG.
FANUC will exhibit three of its all-electric ROBOSHOT injection moulding machines at FAKUMA 2017
Improving productivity and ease of use
At Automaticon 2017 Comau will present the most recent solutions for packaging and palletizing.
At Koplas 2017 Engel will provide demonstrative examples of the opportunities created by digitalisation and networking.